Maßnahmen zur Qualitätssicherung in der Flachbaugruppen-Produktion des Elektronikwerk Wien (EWW)

A considerable part of production costs is spent on quality assurance. With a variety of different test methods production steps are controlled. After a rough survey of different production and test methods we focus on non-automated serial processes, which are still influenced by human errors to a certrain degree. A simple micro processor controlled system was developed to make such processes fail safe. Advantages and disadvantages of using such systems in production are reported. Apart from that special attention is paid to repair techniques. In contrast to the above mentioned process repairing is something which is always done by people with special technical education and it is a non monotonous activity. However, one has to face technological problems. An overview of standard repair techniques (assembling and disassembling of integrated circuits like flip-chip, ball grid arrays BGA and chip size packages CSP) is given. Specially laser soldering of BGAs and flip chip is investigated by practical tests and transient thermal simulation.