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DEPOSITION OF SUBMICRON AEROSOL PARTICLES DURING INTEGRATED CIRCUIT MANUFACTURING: THEORY
Authors:Douglas W Cooper  Robert J Miller  Jin Jwang Wu  Michael H Peters
Affiliation:  a IBM Research Division, T. J. Watson Research Center, New York b Department of Chemical Engineering, Florida State University, Tallahassee, Florida
Abstract:Submicron (≤1μm) particle contamination can produce unacceptably low yields in the manufacture of integrated circuits. Calculations were made to predict deposition velocities of 0·01-lOμm particles, incorporating gravitational, dlffusional, and electrostatic effects. The results were summarized in equations that correlate non-dimensional deposition (Sherwood number) with convective-diffusion (Peclet number) and with electrostatics (Boltzmann and Fuchs charge distributions). These equations were used In conjunction with particle size distributions to predict particle deposition. In a companion paper |25| the predictions were shown to compare well with limited experimental data. To reduce deposition product surfaces should not be electrically charged and, where possible, these surfaces should be at higher temperatures than the ambient gas. For quality control purposes, the deposition flux predictions could serve to link the specifications of gas cleanliness with the specifications of surface cleanliness.
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