| 某电子设备热控系统的设计 |
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| 引用本文： | 祝起凡,段军,杨芳红.某电子设备热控系统的设计[J].电子科技,2016,29(8):28. |
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| 作者姓名： | 祝起凡 段军 杨芳红 |
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| 作者单位： | (西安电子工程研究所 微波工程事业部，陕西 西安 710100) |
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| 摘 要： | 为解决电子设备的散热问题，对某电子设备的热控系统进行了设计，采取了加导热片、填充导热填料等高可靠性导热方式进行散热，并在HyperMesh软件中建立了有限元模型，通过Patran/Nastran软件进行了仿真计算。计算结果表明，采取热控措施后印制板及元器件温度降低，且分布更加均匀，验证了热控系统设计的合理性。
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| 关 键 词： | 电子设备 热控系统 有限元 仿真分析 |
Thermal Control System Design of Electronic Equipment |
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| ZHU Qifan,DUAN Jun,YANG Fanghong.Thermal Control System Design of Electronic Equipment[J].Electronic Science and Technology,2016,29(8):28. |
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| Authors: | ZHU Qifan DUAN Jun YANG Fanghong |
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| Affiliation: | (Microwave Engineering Division,Xian Electronic Engineering Research Institute, Xian 710100, China) |
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| Abstract: | To solve the problem of cooling electronic equipment, we take the reliable cooling plan of adding thermal slices and thermal conductive fillers to design a thermal control system for an electronic equipment. The finite element model is built by HyperMesh. By simulation of Patran/Nastran, the result shows the thermal of PCB and components gets lower and more uniform after taking measures for thermal control. It verifies the rationality of the design for thermal control system. |
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| Keywords: | electronic equipment thermal control system finite element simulation analysis |
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