| 差分过孔的结构分析与优化 |
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| 引用本文： | 周子翔. 差分过孔的结构分析与优化[J]. 电子科技, 2016, 29(6): 100 |
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| 作者姓名： | 周子翔 |
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| 作者单位： | (西安电子科技大学 电子工程学院,陕西 西安 710071) |
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| 摘 要： | 针对差分过孔引起的阻抗不连续以及过孔残桩引起的信号反射问题,通过过孔反焊盘补偿设计及端接过孔残桩减小了差分过孔及残桩引起的反射,改善了接收信号的质量。通过对比差分过孔优化设计前后的频域传输参数和时域信号眼图,说明了本方法的有效性及实用性。
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| 关 键 词： | 差分过孔 残桩 端接阻抗 传输参数 |
Analysis and Optimization of Differential Vias |
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| ZHOU Zixiang. Analysis and Optimization of Differential Vias[J]. Electronic Science and Technology, 2016, 29(6): 100 |
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| Authors: | ZHOU Zixiang |
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| Affiliation: | (School of Electronic Engineering, Xidian University, Xian 710071, China) |
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| Abstract: | To solve the signal reflection problem which is brought by the impedance discontinuity of differential vias, a new structure of differential vias is proposed. This new structure reduces the signal reflection by compensating the anti-pad of differential vias and terminating the stubs. In this way, the quality of received signal is improved. The effectiveness and the practicability of this method are validated by the comparisons of the transmission parameters in frequency domain and the eye diagram in time domain between initial via structure and the optimized via structure. |
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| Keywords: | differential vias stub terminal impedance transmission parameters, |
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