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MEMS中Ni-W合金薄膜力学性能的研究
引用本文:刘瑞,汪红,汤俊,毛胜平,陈辉,丁桂甫.MEMS中Ni-W合金薄膜力学性能的研究[J].传感器与微系统,2009,28(8):46-48.
作者姓名:刘瑞  汪红  汤俊  毛胜平  陈辉  丁桂甫
作者单位:上海交通大学,微纳科学技术研究院,薄膜与微细技术教育部重点实验室微米/纳米加工技术国家级重点实验室,上海,200240 
基金项目:国家"863"计划资助项目 
摘    要:研究了柠檬酸胺-1-羟基乙烷二膦酸(HEDP)镀液体系中Ni-W的力学性能。通过紫外曝光的光刻、电铸和注塑(UV—LIGA)技术制备出微拉伸试样和单轴微拉伸测试系统进行拉伸试验。结果表明:在Ni-W薄膜试样尺寸为5μm×50μm×100μm条件下,其杨氏模量约为100.4GPa,抗拉强度为1.96GPa,应变约为3.6%。

关 键 词:微机电系统  Ni—W合金  电沉积  力学性能  拉伸试验

Study on mechanical properties of Ni-W alloy films in micro-electro-mechanical system
LIU Rui,WANG Hong,TANG Jun,MAO Sheng-ping,CHEN Hui,DING Gui-fu.Study on mechanical properties of Ni-W alloy films in micro-electro-mechanical system[J].Transducer and Microsystem Technology,2009,28(8):46-48.
Authors:LIU Rui  WANG Hong  TANG Jun  MAO Sheng-ping  CHEN Hui  DING Gui-fu
Affiliation:( National Key Laboratory of Micro/Nano Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education,Research Institute of Micro/Nano Science and Technology,Shanghai Jiaotong University ,Shanghai 200240, China)
Abstract:The mechanical properties of Ni-W alloy films electrodeposited in the system of citrate amine-HEDP are sdudied. The testing chip is fabricated with UV-LIGA technology and measured by uniaxial micro-tensile system. The gauge section of Ni-W thin film specimen is 5 μm × 50 μm × 100 μm. The results show that the Young's modulus of Ni-W film is about 100.4 GPa, tensile strength is about 1.96GPa and strain is about 3.6% , respectively.
Keywords:MEMS  Ni-W alloy  electro deposition  mechanical properties  tensile test
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