| 无铅可焊性电镀的现状与发展 |
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| 引用本文： | 周良全.无铅可焊性电镀的现状与发展[J].涂料涂装与电镀,2006,4(4):33-38. |
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| 作者姓名： | 周良全 |
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| 作者单位： | 成都麦菲其化工科技有限公司,四川成都611041 |
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| 摘 要： | 由于环境保护的需要，对电子产品的要求越来越严格，开发和应用新型无铅电镀工艺已经成为绿色电子工业的趋势。本文介绍了近年来电子工业中锡和锡铅合金电镀的应用情况，探讨了各种替代Sn—Pb合金的无铅可焊性合金镀层，并对这些工艺做出了评价，分析论证了锡须生长的原理，指出了无铅可焊性电镀的发展方向。
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| 关 键 词： | 无铅电镀 可焊性 锡须 |
| 收稿时间： | 2006-04-20 |
Present Condition and Development of Lead- Free Solder Electroplating Coating |
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| Zhou Liangquan.Present Condition and Development of Lead- Free Solder Electroplating Coating[J].Coatings Painting & Electroplating,2006,4(4):33-38. |
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| Authors: | Zhou Liangquan |
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| Abstract: | The text introduced the application of electroplating Sn and Sn- Pb aUoy used in electronic industry. Kind of Sn- Pb alloy substitutes for lead- free solderable coating are approached. Make a evaluation for these technics. Analyse and prove the principle of whisker growth. Finally, developing orientation of lead- free esolderable lectroplate. |
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| Keywords: | lead-free electroplating solderability whisker |
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