| PTH制程的稳定性控制 |
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| 引用本文： | 孙光炜.PTH制程的稳定性控制[J].印制电路信息,2004(7):28-31. |
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| 作者姓名： | 孙光炜 |
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| 作者单位： | 汕头超声印制板公司(一厂),515041 |
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| 摘 要： | 简单介绍了碱性离子钯活化体系在PTH制程中的应用,通过正交试验优化PTH重要工艺参数。介绍了PTH常见故障及其排除方法,分析了多层线路板生产中去钻污段调整对化学沉铜过程的可能影响机理。阐述了PTH制程中去钻污对背光稳定性的贡献及传统PTH制程对高厚径比板件孔金属化过程的控制方向。
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| 关 键 词： | PTH 去钻污 背光 化学镀铜 厚径比 |
Control of PTH Process |
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| Sun Guargwei.Control of PTH Process[J].Printed Circuit Information,2004(7):28-31. |
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| Authors: | Sun Guargwei |
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| Affiliation: | Sun Guargwei |
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| Abstract: | The paper briefly introduces the application of ionic activator system based on alkaline organic Pdcomplex in PTH process.Some key parameters in the PTH process are optimized by DOE, some troubles shooting in common are exampled while the possibility mechanism of the conditioner is analyzed after etchback in multi-layer board process. In this paper,we also discussed the desmear's contribution to back-light mantitude and methods to control high aspect Ratio PCB metalization in traditional PTH process. |
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| Keywords: | PTH desmear back-light electroless copper aspect ratio |
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