| 化学镀Ni-Cu-P合金工艺研究 |
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| 引用本文： | 叶栩青,罗守福,王永瑞.化学镀Ni-Cu-P合金工艺研究[J].电镀与环保,2000,20(1):18-21. |
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| 作者姓名： | 叶栩青 罗守福 王永瑞 |
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| 作者单位： | 上海交通大学,上海,200030 |
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| 摘 要： | 通过大量实验数据及图表论述了化学镀Ｎｉ－Ｃｕ－Ｐ的工艺条件，探讨了认的主要组成，镀液的ＰＨ值、施镀时间对镀层中Ｎｉ、Ｃｕ、Ｐ含量及镀层的沉积速度的影响，总结了随工艺参数变化镀层成分变化的趋势及规律。
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| 关 键 词： | 化学镀 镀层 电镀 镍铜磷合金 镀合金 |
| 修稿时间： | 1999-07-26 |
Study of Electroless Ni-Cu-P Alloy Process |
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| Abstract: | Technology of electroless plating Ni Cu P alloy were investigated through a great deal experiments. Influence of component and pH of the bath and plating time on the content of Ni, Cu, P in the coating and the deposition rate of the alloy was discussed and tendency of coating component with changing technology parameters was summarised. |
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| Keywords: | Electroless Ni Cu P Coating component |
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