Microstructural analysis of fracture toughness variation in 2XXX-series aluminum alloy composites reinforced with SiC whiskers |
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Authors: | Sunghak Lee Tae Hyung Kim Dongil Kwon |
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Affiliation: | (1) Center for Advanced Aerospace Materials, Pohang University of Science and Technology, 790-784 Pohang, Korea;(2) Sam Sung Display Devices Co., Ltd., 445-970 Hwasung-Kun, Korea;(3) Department of Materials Science and Engineering, Changwon National University, 641-773 Changwon, Korea |
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Abstract: | The effects of local microstructure on fracture properties in powder-metallurgy (P/M)-processed 2124/SiC/15w and 2009/SiC/15w composites are analyzed in this study. Ductility and fracture toughness of the 2009/SiC/15w, in which dispersoid-forming elements such as manganese and iron were nearly absent, were greater than in the 2124/SiC/15w, while its tensile and yield strengths were somewhat less. Microstructural examination and fracture parameter analysis revealed that the improved fracture toughness of the 2009/SiC/15w compared to the 2124/SiC/15w was due to the increase in the critical microstructural distance,l* when manganese-containing particles are absent. 2009/SiC/15w was also heat-treated in T4P and overaged (OA) conditions. The OA 2009 composite showed lower fracture toughness than the 2009-T4P composite and the critical fracture strain of the OA condition was much lower, too. Detailed fractographic analyses indicated that interface precipitates facilitate premature SiC whisker failure in the OA condition. Formerly Research Assistant, Department of Materials Science and Engineering Pohang University of Science and Technology, Pohang, 790-784 Korea |
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