| 后摩尔时代的封装技术 |
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| 引用本文： | 童志义.后摩尔时代的封装技术[J].电子工业专用设备,2008,37(9). |
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| 作者姓名： | 童志义 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,东燕郊,101601 |
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| 摘 要： | 综述了进入后摩尔时代半导体业界面临制造技术极限的挑战所进行的各种应对措施的现状,着重介绍了叠层封装、系统级封装、晶圆级封装、硅通孔技术等一些新型的三维垂直封装技术在电子电路集成方面的进展及高密度3D芯片封装的前景。
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| 关 键 词： | 摩尔定律 垂直封装 叠层封装 系统级封装 晶圆级封装 硅通孔技术 |
Package Technology of the Post - Moore Era |
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| TONG Zhi-yi.Package Technology of the Post - Moore Era[J].Equipment for Electronic Products Marufacturing,2008,37(9). |
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| Authors: | TONG Zhi-yi |
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| Abstract: | This paper overviews the present status of different kinds of reply means faced by semicon- ductor industry for challenge of critical fabrication techniques after entering the post Moore Era,it main- ly introduces POP、SIP、WLP and TSV etc.It illustrates these new types of 3D vertical package technique advance in electronic circuit integration respect and the future prospect of high density 3D chip package. |
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| Keywords: | Moore's Law Vertical Package POP SIP WLP STV Technique |
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