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Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor |
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| Authors: | Wang Aochen Wang Shengli Liu Yuling Li Yan |
| Affiliation: | Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China;Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China;Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China;Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China |
| Abstract: | alkaline slurry electrochemical copper CMP surface roughness |
| Keywords: | alkaline slurry electrochemical copper CMP surface roughness |
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