1. Smart and Adaptive Polymers Laboratory, Department of Mechanical and Industrial Engineering, University of Toronto, 5 King's College Road, Toronto, Ontario M5S 3G8, Canada;2. Department of Electrical and Computer Engineering, University of Toronto, 10 King's College Road, Toronto, Ontario M5S 3G4, Canada;3. AEG Power Solutions Inc., 2680 Fourteenth Avenue, Markham, Ontario L3R 5B2, Canada
Abstract:
Multifunctional materials that are lightweight and thermally conductive but electrically insulating are important for modern electronics, computer, and telecommunication technologies. Here, a novel foam structure of a polymer/matrix composite filled with ceramic platelets with improved thermal conductivity is reported. Such improvement is caused by the stress‐induced alignment of thermally conductive fillers in the cell wall of the plastic foam. The foam structure is very promising for use as a lightweight electronic packaging material owing to its light weight, thermal conduction ability, electrical insulation, and good processability.
