Ultra-thin pocket embedding package for system in package |
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Authors: | Kim K.M. Sohn B. Yook J.M. Yeo S.K. Kwon Y.S. |
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Affiliation: | Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Yuseong-Gu Daejeon; |
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Abstract: | Proposed is a new type of packaging technology, `pocket embedding package', using selectively anodised aluminium substrate. In this technology, chips can be embedded inside aluminium substrate so that an ultra-thin and compact type of package can be achieved. A monolithic microwave integrated circuit dice with 120 mum thickness has been successfully embedded inside the substrate with a tolerance of less than 5 mum, and 300 mum of total thickness can be achieved with excellent thermal dissipation |
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