Thermal analysis of multiple-layer structures

The response of temperature to dc and steady-state ac power inputs in multiple-layer rectangular structures has been derived by solving analytically the problem of heat flow in three dimensions. Attention is focused on electrothermal integrated circuit (IC) substrates consisting of a semiconductor, a thermal conductor, and a thermal insulator. The analysis applies as well to single-layer systems, such as conventional IC substrates, for which the transient response of temperature has also been found.