| 锌对SnxZn/Cu界面微空洞的影响 |
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| 引用本文： | 杨扬,陆皓,余春,陈俊梅,陈振英.锌对SnxZn/Cu界面微空洞的影响[J].焊接学报,2013,34(1):53-56. |
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| 作者姓名： | 杨扬 陆皓 余春 陈俊梅 陈振英 |
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| 作者单位： | 1. 上海交通大学材料科学与工程学院,上海,200240
2. 上海交通大学材料科学与工程学院,上海 200240;上海交通大学激光制造与材料改性上海市重点实验室,上海 200240 |
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| 基金项目： | 国家自然科学基金资助项目(50975176,51105251) |
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| 摘 要： | 通过向锡钎料中添加不同含量的Zn元素,系统研究了锌对SnxZn/Cu(x=0,0.2,0.5,0.8(质量分数,％))界面处柯肯达尔空洞形成的影响.结果表明,经热老化处理后,纯Sn/Cu接头中的Cu3 Sn层和Cu3 Sn/Cu界面出现了大量柯肯达尔空洞.然而随着Zn元素含量的增加,反应界面处的Cu3Sn层逐渐变薄甚至消失,柯肯达尔空洞也随之显著减少或消失；锌在反应界面处的富集现象越来越显著.锌参与了界面反应,形成了(Cu,Zn)6Sn5相、Cu6(Sn,Zn)5相和Cu-Zn固溶合金,其中Cu-Zn固溶合金层可以显著影响铜的界面扩散.Zn元素直接参与了界面扩散,在很大程度上缓和铜和锡的不平衡扩散,从而有效抑制了柯肯达尔空洞的形成.
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| 关 键 词： | 锌 界面 柯肯达尔空洞 金属间化合物 |
| 收稿时间： | 2011/11/22 0:00:00 |
Effect of Zn on formation of voids on SnxZn/Cu interface |
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| YANG Yang,LU Hao,YU Chun,CHEN Junmei and CHEN Zhenying.Effect of Zn on formation of voids on SnxZn/Cu interface[J].Transactions of The China Welding Institution,2013,34(1):53-56. |
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| Authors: | YANG Yang LU Hao YU Chun CHEN Junmei and CHEN Zhenying |
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| Affiliation: | 1(1.School of Materials Science and Engineering,Shanghai Jiaotong University,Shanghai 200240,China;2.Key Laboratory of Shanghai Laser Manufacturing and Materials Modification,Shanghai Jiaotong University,Shanghai 200240,China) |
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| Abstract: | The effect of Zn on formation of Kirkendall voids on the interface was studied through the reaction between SnxZn solders (x = 0,0.2%,0.5%,0.8%) and the electroplated Cu substrate. During the thermal aging of Sn/Cu joints,a number of Kirkendall voids were formed in the Cu3Sn layer and on the Cu3Sn/EPC interface. With the increase of Zn content in solder,the growth of Cu3Sn layer was greatly suppressed,and the formation of Kirkendall voids was effectively inhibited. The concentration of Zn on the reaction interface also significantly increased. Zn participated in the interface reaction, (Cu,Zn)6Sn5,Cu6(Sn,Zn)5 and Cu-Zn solid-solution alloy were formed,among which the Cu-Zn solid-solution alloy layer can greatly affect the diffusion of Cu. Zn served as a diffusing element during the interface reaction,which can improve the unbalanced diffusion of Cu and Sn to a great degree,and suppress the formation of voids effectively. |
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| Keywords: | Zn interface Kirkendall void intermetallic compound |
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