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镀铜石墨粉的制备研究
引用本文:李艳,肖清贵. 镀铜石墨粉的制备研究[J]. 表面技术, 2006, 35(1): 60-62
作者姓名:李艳  肖清贵
作者单位:桂林工学院有色金属材料及其加工新技术省部共建教育部重点实验室,广西,桂林,541004;北京化工大学教育部超重力工程研究中心,北京,100029
摘    要:表面镀铜的非金属材料是当前功能材料开发的一个热点.利用化学镀的方法在石墨粉的表面进行化学镀铜,通过对化学镀铜沉积速度和镀层表面形貌进行分析,探讨了如何获得表面包覆良好的镀层.石墨粉表面化学镀铜工艺可以分为表面预处理、化学镀和性能测试三大步骤.研究重点放在化学镀施镀步骤上,对化学镀铜的影响因素进行了研究,得出最佳的镀铜工艺配方,并将此配方应用于实际,得到了色泽光亮、分散性好的石墨镀铜粉.

关 键 词:镀铜石墨粉  化学镀  表面形貌
文章编号:1001-3660(2006)01-0060-03
收稿时间:2005-09-12
修稿时间:2005-09-12

Research of Preparation of Cu-coated Ground Graphite
LI Yan,XIAO Qing-gui. Research of Preparation of Cu-coated Ground Graphite[J]. Surface Technology, 2006, 35(1): 60-62
Authors:LI Yan  XIAO Qing-gui
Affiliation:1. Key Laboratory of Nonferrous Materials and New Processing Technology of Ministry of Education, Guilin University of Technology, Guilin 541004, China; 2. Research Center of Ministry of Education for High Gravity Engineering and Technology, Beijing University of Chemical Technology, Beijing 100029, China
Abstract:Cu-coated non-metallic materials is now becoming a spot hot in functional materials field. Cu-coated ground graphite was obtained by electroless plating. The method how to get good copper coating were discussed by analyzing the deposition rate and surface morphology of products. The technics of electroless copper plating on ground graphite were divided into surface pretreatment, electroless plating and performance tests. Electroless copper plating after surface pretreatment was taken as emphasis. The influence factors of electroless copper plating were studied. The best process was obtained by unitary factor testing. Using the optimal plating process, Cu-coated ground graphite with smooth-bright, good adhesive, high stability and good visualization was obtained.
Keywords:Cu-coated ground graphite   Electroless plating   Surface morphology
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