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Flexible Gallium Nitride for High‐Performance,Strainable Radio‐Frequency Devices
Authors:Nicholas R Glavin  Kelson D Chabak  Eric R Heller  Elizabeth A Moore  Timothy A Prusnick  Benji Maruyama  Dennis E Walker Jr  Donald L Dorsey  Qing Paduano  Michael Snure
Affiliation:1. Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright‐Patterson AFB, OH, USA;2. Air Force Research Laboratory, Sensors Directorate, Wright‐Patterson AFB, OH, USA;3. KBRwyle, Dayton, OH, USA
Abstract:Flexible gallium nitride (GaN) thin films can enable future strainable and conformal devices for transmission of radio‐frequency (RF) signals over large distances for more efficient wireless communication. For the first time, strainable high‐frequency RF GaN devices are demonstrated, whose exceptional performance is enabled by epitaxial growth on 2D boron nitride for chemical‐free transfer to a soft, flexible substrate. The AlGaN/GaN heterostructures transferred to flexible substrates are uniaxially strained up to 0.85% and reveal near state‐of‐the‐art values for electrical performance, with electron mobility exceeding 2000 cm2 V?1 s?1 and sheet carrier density above 1.07 × 1013 cm?2. The influence of strain on the RF performance of flexible GaN high‐electron‐mobility transistor (HEMT) devices is evaluated, demonstrating cutoff frequencies and maximum oscillation frequencies greater than 42 and 74 GHz, respectively, at up to 0.43% strain, representing a significant advancement toward conformal, highly integrated electronic materials for RF applications.
Keywords:flexible GaN  flexible RF electronics  gallium nitride
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