Chemical Intercalation of Topological Insulator Grid Nanostructures for High‐Performance Transparent Electrodes |
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Authors: | Yunfan Guo Jinyuan Zhou Yujing Liu Xu Zhou Fengrui Yao Congwei Tan Jinxiong Wu Li Lin Kaihui Liu Zhongfan Liu Hailin Peng |
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Affiliation: | 1. Center for Nanochemistry, Beijing Science and Engineering Center for Nanocarbons, Beijing National Laboratory for Molecular Sciences, College of Chemistry and Molecular Engineering, Peking University, Beijing, P. R. China;2. Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, P. R. China;3. State Key Laboratory for Mesoscopic Physics, School of Physics, Center for Nanochemistry, Peking University, Beijing, P. R. China |
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Abstract: | 2D layered nanomaterials with strong covalent bonding within layers and weak van der Waals' interactions between layers have attracted tremendous interest in recent years. Layered Bi2Se3 is a representative topological insulator material in this family, which holds promise for exploration of the fundamental physics and practical applications such as transparent electrode. Here, a simultaneous enhancement of optical transmittancy and electrical conductivity in Bi2Se3 grid electrodes by copper‐atom intercalation is presented. These Cu‐intercalated 2D Bi2Se3 electrodes exhibit high uniformity over large area and excellent stabilities to environmental perturbations, such as UV light, thermal fluctuation, and mechanical distortion. Remarkably, by intercalating a high density of copper atoms, the electrical and optical performance of Bi2Se3 grid electrodes is greatly improved from 900 Ω sq?1, 68% to 300 Ω sq?1, 82% in the visible range; with better performance of 300 Ω sq?1, 91% achieved in the near‐infrared region. These unique properties of Cu‐intercalated topological insulator grid nanostructures may boost their potential applications in high‐performance optoelectronics, especially for infrared optoelectronic devices. |
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Keywords: | Bi2Se3 Cu atoms intercalation topological insulators transparent electrodes |
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