| 双面电镀在先进封装中应用的可行性研究 |
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| 引用本文： | Richard Hollman. 双面电镀在先进封装中应用的可行性研究[J]. 电子工业专用设备, 2012, 41(3): 17-19 |
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| 作者姓名： | Richard Hollman |
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| 作者单位： | 美国英科系统股份有限公司,Billerica,MA01821—3929,USA |
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| 摘 要： | 在晶圆双面及孔的侧壁用一种简单的工序电沉积金属的能力,在先进封装和某些工艺中提供了一些基本的优势。双面电镀样机硬件已经过用配置垂直电镀槽的生产型ECD装置的试验。这种工艺已经成功地在几种不同的金属和多种应用中得以展示。
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| 关 键 词： | 3D封装 硅通孔 封装体叠层 倒装芯片 双面电镀 电镀 |
Feasibility of Double-sided Electroplating for Advanced Packaging Applications |
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| Affiliation: | Richard Hollman(NEXX Systems, Inc.Billerica, MA 01821-3929 USA) |
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| Abstract: | The ability to electrodeposit metals on both sides of a wafer and on the sidewalls of vias in a single step offers some key advantages in advanced packaging and other processes. Prototype double-sided plating hardware has been tested in a production ECD tool with vertical plating cells. This process has been successfully demonstrated for several different metals and multiple applications. |
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| Keywords: | 3D packaging TSV package-on-package flip chip double-sided plating electroplating. |
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