硼硅酸盐玻璃的低温烧结研究

莫来石陶瓷材料作为高性能集成电路的候选材料,在电子封装基片领域有着广阔的应用前景,但过高的烧结温度限制了其发展。本文利用溶胶-凝胶法制备能够在低温实现烧结的硼硅酸盐玻璃,作为引入相以实现莫来石陶瓷封装材料的低温共烧,通过研究CaO、B2O3、SiO2的不同组成并引入ZnO、P2O5作为助烧剂,最终制得了能够在800℃实现低温烧结的硼硅酸盐玻璃,其线性收缩率约为22.4%~24.0%,表观密度为2.21±0.1,ε=4.1±0.2,tgδ<0.06%,Rj>1.0×1012Ω.cm。

Research on Low-temperature Sintering of Boracic Silicate Glass

As mullite ceramic becomes a candidate material for high-capability IC,its foreground becomes wide in the area of electric package substrate,while over-high sintering temperature limits its development.Boracic silicate glass which can be sintered at low temperature was prepared by sol-gel process.Mullite ceramic can be sintered at low temperature when the boracic silicate glass is introduced into it.Proportion of CaO,B_2O_3,SiO_2 was studied and ZnO,P_2O_5 was introduced,and then boracic silicate glass sintered at 800℃ with excellent dielectric properties of linearity shrink rate=22.4%～24.0%,surface ρ=2.21±0.1g/cm3,ε=4.1±0.2,tgδ<0.06%,R_j>1.0×1012Ω·cm was obtained.