| 电解铜箔产业发展与分析 |
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| 引用本文： | 金荣涛. 电解铜箔产业发展与分析[J]. 印制电路信息, 2004, 0(12): 17-20,39 |
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| 作者姓名： | 金荣涛 |
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| 作者单位： | 铜都铜业股份公司,244000 |
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| 摘 要： | 根据我国电解铜箔的发展现状,结合铜箔市场的特点,综合分析了我国电解铜箔产业的特点,提出制约我国铜箔发展的关键因素在于生产工艺理论不完善,铜箔项目建设缺乏对用户研究,铜箔技术研究错位。
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| 关 键 词： | 电解铜箔 市场分析 限制因素 |
Development and Analyse of Electrodeposited Copper Foil Industry |
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| Jin Rongtao. Development and Analyse of Electrodeposited Copper Foil Industry[J]. Printed Circuit Information, 2004, 0(12): 17-20,39 |
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| Authors: | Jin Rongtao |
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| Affiliation: | Jin Rongtao |
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| Abstract: | According to the electrodeposited copper foil development present condition outset, combinationcopper foil the market's characteristics, synthesized to analyze the copper foil key factor that the property's character-istics, bring upped the system roughly our country copper the foil develop to consist in the copper foil the productionthe craft theories not perfect, copper foil item developments lack to study to customer, copper foil technique develop-ment mistake etc. |
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| Keywords: | electrodeposited copper foil market analysis limiting factor |
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