| 环保型乙醛酸为还原剂的化学镀铜液的研究进展 |
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| 引用本文： | 李卫明,刘彬云,王恒义,薛怀玉. 环保型乙醛酸为还原剂的化学镀铜液的研究进展[J]. 印制电路信息, 2006, 0(8): 24-27 |
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| 作者姓名： | 李卫明 刘彬云 王恒义 薛怀玉 |
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| 作者单位： | 广东光华化学厂有限公司,515021 |
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| 摘 要： | 介绍了环保型乙醛酸为还原剂的化学镀铜镀液的组成、各组分的作用和镀液中主要副产物的影响及处理方法,并介绍本公司近期的研究进展。
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| 关 键 词： | 乙醛酸 化学镀铜 还原剂 |
The Solution Study of Electroless Copper Plating Using Nontoxic Glyoxylic Acid as Reducing Agent |
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| Li Weiming,Liu Binyun,Wang Hengyi,Xue Huaiyu. The Solution Study of Electroless Copper Plating Using Nontoxic Glyoxylic Acid as Reducing Agent[J]. Printed Circuit Information, 2006, 0(8): 24-27 |
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| Authors: | Li Weiming Liu Binyun Wang Hengyi Xue Huaiyu |
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| Affiliation: | Li Weiming Liu Binyun Wang Hengyi Xue Huaiyu |
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| Abstract: | The solution of the electroless copper plating using nontoxic glyoxylic acid as the reducing agent isdescribed in this article. The content includes the solution compounds, the function of the compounds and the effectof the main byproduct. Furthermore, the recent study of the solution from our company is introduced. |
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| Keywords: | glyoxylic acid electroless copper plating reducing agent |
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