Improving photocatalytic activity of Cu-loaded TiO2 film using a pulse anodic bias

The application of a small anodic bias can promote the photocatalytic oxidation of formic acid on Cu–TiO₂ film. However, the photocatalytic activity was not stable at higher anodic biases or in the process of repeated use due to the electrochemical oxidation of Cu. A new photocatalytic technology with a pulse anodic bias was proposed to tackle the deficiency of the Cu–TiO₂ film. It was found that the photocatalytic technology could not only overcome the Cu oxidation but also increased the photocatalytic activity of the Cu–TiO₂ film.