Residual compressive stress in sputter-deposited TiC films on steel substrates

Polycrystalline TiC films with thickness between 0.1 and 2.8 microm were deposited by r.f. sputtering onto 1010 steel and borosilicate glass substrates at 200°C. All films were found to be in a state of compression. For a film grown under a given set of deposition conditions, the incremental compressive stress, i.e. the average stress in the uppermost deposited layer, was generally found to be largest near the film-substrate interface and to become constant with film thickness t_f for t_f ? 0.3 microm. However, for a given t_f the incremental stress increased with a decrease in the argon sputtering pressure P_Ar. Experimental results showed that the incremental compressive stress in bulk films could be directly related to the trapped argon concentration. Argon incorporation is due to the burial of energetic species incident on the growing film surface from two primary sources: energetic neutrals produced by Ar⁺ ions scattered off the target in binary collisions and Ar⁺ ions accelerated to the substrate owing to its induced negative potential with respect to the positive space charge region in the r.f. discharge. The trapped argon concentration from both contributions increased with decreasing P_Ar. All films grown on steel substrates exhibited good adhesion as indicated by indentation and diamond stylus scratch tests. The residual compressive stress in the films was found to be beneficial for wear-related applications in which the film was subjected to a large tensile stress.