Effect of Residual Stress on the Stability of Gold Thin Film Surfaces

The temporal evolution of the surface topography and x-ray diffractogram of gold thin films was obtained. We found by STM that the surface roughness decreased exponentially with time. X-ray analysis indicates that the microcrystals are strained i.e., the x-ray peaks shift with elapsed time towards the gold standard reflections. The rearrangement of the gold film is induced by surface strains that appear during film growth rather than by the thermal motion of atoms. A DC current was applied to the films to induce surface changes and to study electromigration phenomena. Results show that current effects accelerate film failure by surface diffusion produced by the growth of microcrystals at the expense of mechanically strained microcrystals.