| 军用塑封器件失效机理研究和试验流程 |
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| 引用本文： | 盛念.军用塑封器件失效机理研究和试验流程[J].电子产品可靠性与环境试验,2012(2):6-10. |
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| 作者姓名： | 盛念 |
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| 作者单位： | 空军驻广州深圳地区军事代表室,广东广州510310 |
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| 摘 要： | 由于其结构和材料等因素,侵蚀、"爆米花"效应和易受温度形变是塑封器件常见的失效机理,在其装入整机之前必须经过严格的可靠性评价或筛选以降低风险。推荐了一套优化的塑封器件试验流程,试验评价流程组合包括无损的外目检、X射线检查、声学扫描显微镜检查,以及具有破坏性的DPA、寿命试验和耐潮性项目。该试验评价程序针对主要的失效机理,充分考虑了塑封器件的批质量一致性、高温下的器件寿命和耐潮性,可以作为军用塑封器件的主要评价手段。
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| 关 键 词： | 塑封器件 失效机理 试验流程 |
Failure Mechanism Research and Test Procedure for Military Plastic Encapsulated Microcircuit |
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| SHENG Nian.Failure Mechanism Research and Test Procedure for Military Plastic Encapsulated Microcircuit[J].Electronic Product Reliability and Environmental Testing,2012(2):6-10. |
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| Authors: | SHENG Nian |
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| Affiliation: | SHENG Nian(Military Representative Office of the Air Force Stationed in the Area of Guangzhou and Shenzhen,Guangzhou 510310,China) |
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| Abstract: | Erosion,pop corning and thermal mechanical distortion have become the primary failure mechanisms for plastic encapsulated microcircuits（PEMs）due to the characteristics of their structures and materials.In order to reduce risks,PEMs must be carefully evaluated before being assembled.In this paper,an optimized testing procedure for PEMs that combined with visual inspection,X-ray inspection,acoustic microscopy,DPA,life testing and moisture resistant testing is recommended.Based on the primary mechanism,the proposed procedure have fully taken lot conformance,device lifetime under high temperature and the moisture resistance of PEMs into account.The test procedure could be used as the major approach for evaluating military PEMs. |
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| Keywords: | plastic encapsulated microcircuit（PEM） failure mechanism test procedure |
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