| 导热绝缘高分子复合材料的研究进展 |
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| 引用本文： | 任芳,任鹏刚,狄莹莹.导热绝缘高分子复合材料的研究进展[J].包装工程,2009,30(2). |
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| 作者姓名： | 任芳 任鹏刚 狄莹莹 |
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| 作者单位： | 西安理工大学,西安,710048;西安理工大学,西安,710048;西安理工大学,西安,710048 |
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| 摘 要： | 介绍了导热绝缘高分子复合材料的导热机理及制备方法.论述了导热绝缘高分子复合材料的研究进展,包括导热绝缘填料、导热绝缘橡胶、导热绝缘塑料及导热绝缘胶粘剂的研究.最后阐述导热绝缘复合材料的应用及发展方向.
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| 关 键 词： | 导热绝缘 导热机理 复合材料 导热填料 |
Research Progress of Thermal Conductive and Dielectric Polymer Composites |
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| REN Fang,REN Peng-gang,DI Ying-ying.Research Progress of Thermal Conductive and Dielectric Polymer Composites[J].Packaging Engineering,2009,30(2). |
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| Authors: | REN Fang REN Peng-gang DI Ying-ying |
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| Affiliation: | REN Fang,REN Peng-gang,DI Ying-ying(Xi'an University of Technology,Xi'an 710048,China) |
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| Abstract: | Thermal conducting mechanism and the preparation methods of thermally conductive and dielectric polymer composites were introduced.The research progress in the thermally conductive and dielectric polymer composites was reviewed,including thermal conductive filling,composite plastics,rubbers and adhesives.The applications and development direction of thermally conductive and dielectric polymer composites were also introduced. |
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| Keywords: | thermally conductive and dielectric thermal conducting mechanism composites thermal conductive filling |
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