Superplastic creep of eutectic tinlead solder joints |
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Authors: | Z Mei D Grivas M C Shine J W Morris |
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Affiliation: | (1) Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, 94720 Berkeley, CA;(2) Digital Equipment of Corporation, 95014 Cupertino, CA |
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Abstract: | This paper presents experimental evidence that as-solidified eutectic Pb-Sn solder joints can exhibit superplastic behavior
in shear creep loading. Stepped load creep tests of as-solidified joints show a change in the stress exponent from a high
value typical of con-ventional creep at high stress and strain rate to a superplastic value near 2 at lower stress and strain
rates. In addition, the change in stress exponent is accompanied by a change in the activation energy for creep from a value
near that for bulk self-diffusion (20 kcal/mol) to a value near that for grain boundary diffusion (12 kcal/mol). The total
shear deformation of joints in stress-rupture tests performed at 65° C are found to ex-ceed 150%. The concomitant observation
that quenched solder joints creep faster than air-cooled ones is attributed to a grain, or phase, size dependence of the strain
rate. The source of superplastic behavior is a fine, equiaxed microstructure. It is not yet clear whether the superplastic
microstructure is present in the as-solidified joint, or develops during the early stages of plastic deformation. |
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Keywords: | Creep of solder joint superplasticity of tin-lead solder |
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