铜在甲胺-铁氰化钾化学机械抛光液中的腐蚀与钝化

用电化学测试技术研究了腐蚀介质和成膜剂浓度对铜表面的腐蚀与钝化成膜的影响，分析了钝化膜的成分，探讨了钝化膜在抛光压力和转速作用下的磨损与表面再钝化的行为，测量了铜在化学机械抛光过程中的极化曲线。结果表明铜在甲胺溶液介质铁氰化钾抛光液中易钝化，钝化膜的主要成分为Cu4Fe(CN)6]，有少量Cu20存在。钝化膜的磨损特性随成分浓度不同而不同。钝化膜的磨损难易程度与钝化膜的本身特性、抛光压力及转速有关。抛光过程中因钝化膜被磨损，腐蚀加快，腐蚀电流密度大幅增加。配方0．1％甲胺溶液 0．5％K3Fe(CN)6 5％Al2O3可行。

Corrosion and passivation of copper in the CMP slurry of CH3NH2-K3 [ Fe( CN )6 ]

The influence of the corrosive medium and passivator concentrations on the corrosion and passivation of copper was studied by electrochemical messurement technologies. The components of the passive films were analysed with XPS. The behavour of abration, which was performed with polishing pressure and rotationl velocity, and repassivation on the surface of copper was invesitigated. The polarization curves of copper during chemical mechanical polishing were messured. The results indicated that, copper was passivated very easily in the methylamine aqueous medium with K_3Fe(CN)_6, the main components of the passive films were Cu_4Fe(CN)_6] and a little Cu_2O. The abration characteristics of films varied with the components concentrations. Whether difficult or easy the passive films were abraded depended on the properties of the films, the polishing pressures and rotational velocities. Because of the films being abraded during polishing, the corrosion rate was quickened and the corrosion current density was increased greatly. The slurry of 0.1% methylamine aqueous solution+0.5%K_3Fe(CN)_6+5%Al_2O_3 was feasible.