Copper Nanoparticles Grafted on a Silicon Wafer and Their Excellent Surface‐Enhanced Raman Scattering |
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| Authors: | Qi Shao Ronghui Que Mingwang Shao Liang Cheng Shuit‐Tong Lee |
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| Affiliation: | 1. Institute of Functional Nano and Soft Materials (FUNSOM), Jiangsu Key Laboratory for Carbon‐Based Functional Materials and Devices, Soochow University, Suzhou, Jiangsu 215123, P. R. China;2. Department of Chemistry, Hefei National Laboratory for Physical Sciences at the Microscale, The University of Science and Technology of China, Hefei, Anhui 230026, P. R. China;3. Center of Super‐Diamond and Advanced Films, Department of Physics and Materials Science, City University of Hong Kong, Hong Kong SAR, P. R. China |
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| Abstract: | Copper nanoparticles grafted on a silicon wafer are fabricated by reducing copper ions with silicon–hydrogen bonds and assembling them in situ on the Si wafer. The nanoparticles, with an average size of 20 nm, grow uniformly and densely on the Si wafer, and they are used as substrates for surface‐enhanced Raman scattering. These substrates exhibit excellent enhancement in the low concentration detection (1 × 10?9 M ) of rhodamine 6G with an enhancement factor (EF) of 2.29 × 107 and a relative standard deviation (RSD) of <20%. They are also employed to detect sudan‐I dye with distinguished sensitivity and uniformity. The results are interesting and significant because Cu substrates are otherwise thought to be poor. These effects might provide new ways to think about surface‐enhanced Raman scattering based on Cu substrates. |
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| Keywords: | surface‐enhanced Raman scattering (SERS) Cu nanoparticles Si– H bonds assembly |
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