| 微纳米级键合强度分析(英文) |
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| 引用本文： | 阮勇,尤政,张大成.微纳米级键合强度分析(英文)[J].纳米技术与精密工程,2012(6):481-485. |
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| 作者姓名： | 阮勇 尤政 张大成 |
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| 作者单位： | [1]清华大学精密仪器与机械学系,北京100084 [2]北京大学微电子所,北京100871 |
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| 基金项目： | 基金项目：教育部高等学校博士学科点专项科研基金资助项目（20091011292）;清华大学精密测试国家重点实验室基金资助项目 Acknowledgement The authors would like to thank Peking University National Key Laboratory of Micro/Nano Fabrication Technology for providing the bonding experimental facilities. |
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| 摘 要： | 本文主要研究了微米/纳米尺度的键合技术和键合强度,给出并发展了基于MEMS技术的微米/纳米键合分析模型.为提取微米/纳米键合面积的最大剪应力和压应力,设计、制备和测试了一系列单晶硅悬臂梁结构.并使用理论公式和ANSYS有限元模拟对实验结果进行了分析.键合强度可以分为扭转和剪压表征两部分.根据测试值可得,最大抗扭强度为1.9×109μN.μm,最大压应力为68.3 MPa.
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| 关 键 词： | MEMS 阳极键合 键合强度 |
Bonding Strength at Micro and Nano Levels |
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| RUAN Yong,YOU Zheng,ZHANG Da-Cheng.Bonding Strength at Micro and Nano Levels[J].Nanotechnology and Precision Engineering,2012(6):481-485. |
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| Authors: | RUAN Yong YOU Zheng ZHANG Da-Cheng |
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| Affiliation: | 1. Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084 2. Institute of Microelectronics, Peking University, Beijing 100871, China) |
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| Abstract: | This paper focuses on micro and nano bonding technology and bonding strength. The micro electro mechanical system （MEMS） models were set up and improved. A series of single crystal cantilever beams were designed, fabricated and tested for the maximum shear stress and pressure stress measurement of bonding strength at micro or nano levels. The formula and ANSYS simulation results are consistent with the experimental ones. Bonding strength can be considered as two parts： torsional strength and pressure stress. The maximum torsional strength is 1.9×10^9 μN μm and the maximum pressure stress is 68.3 MPa. |
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| Keywords: | MEMS anodic bonding bonding strength |
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