| 基于Ansys优化模块的热设计应用 |
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| 引用本文： | 梁仕章,徐卫华.基于Ansys优化模块的热设计应用[J].电子产品可靠性与环境试验,2014(2):29-33. |
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| 作者姓名： | 梁仕章 徐卫华 |
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| 作者单位： | 工业和信息化部电子第五研究所,广东广州510610 |
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| 基金项目： | 国家科技支撑计划项目“电子产品生态设计云服务平台”（2012BAH27F02）资助 |
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| 摘 要： | 发热量大的电子器件温度会比较高,过高的温度会影响到器件的正常工作,因此需要用到热仿真软件去进行有效的热设计。优化设计是有限元分析软件(Ansys)的特有模块,利用该模块应用于两种典型的热设计实例,分别是处理器CPU散热器结构和电路板器件分布的优化设计,仿真分析出来的结果显示,CPU散热器的散热性能得到明显的提高,电路板上各器件的温度均得到降低,获得良好的优化效果。
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| 关 键 词： | 有限元分析软件 优化设计 热设计 温度 |
Application of Thermal Design Based on Ansys Optimization Module |
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| LIANG Shi-zhang,XU Wei-hua.Application of Thermal Design Based on Ansys Optimization Module[J].Electronic Product Reliability and Environmental Testing,2014(2):29-33. |
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| Authors: | LIANG Shi-zhang XU Wei-hua |
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| Affiliation: | (CEPREI, Guangzhou 510610, China) |
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| Abstract: | bstract： Temperature of Electronic devices with larger heat will be relatively high. When the temperature is too high, it will seriously affect the life of the device. Therefore, the thermal simulation software is needed for effective thermal design. Optimized design is a specific module of Ansvs. In this paper, the module is applies to the thermal design of two typical examples, includes processor CPU heat sink structure and the distribution of components on the circuit board. The results of the simulation analysis show that the thermal performance of the CPU heat sink is significantly improved, and the temperature of the device on the board is reduced, which provides a good optimization result. |
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| Keywords: | Ansys optimal design thermal design temperature |
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