| 铜铟铋硫对Sn-Ag基无铅焊料性能的影响 |
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| 引用本文： | 林培豪,刘心宇,成钧.铜铟铋硫对Sn-Ag基无铅焊料性能的影响[J].电子元件与材料,2003,22(10):33-34. |
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| 作者姓名： | 林培豪 刘心宇 成钧 |
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| 作者单位： | 桂林电子工业学院,广西,桂林,541004 |
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| 摘 要： | 研究了Cu、In、Bi、S元素对Sn-Ag基无铅焊料熔点和铺展性的影响。结果表明:Sn-Ag-Cu三元合金成分为95.5%Sn3.5%Ag1%Cu时具有较低熔点(215℃)和好的铺展性;加入适量的In可降低Sn-Ag合金的熔点和改善铺展性能;随w(Bi)的增加Sn-Ag-Bi三元合金的熔点降低、铺展性变好;Sn-Ag合金的熔点随w(S)的增加而升高,加入少量S能改善Sn-Ag合金的铺展性。
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| 关 键 词： | Sn-Ag合金 无铅焊料 熔点 铺展性 |
| 文章编号： | 1001-2028(2003)10-0033-02 |
Effect of Cu, In, Bi, S on the Properties of Sn/Ag Based Lead-free Solder |
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| LIN Pei-hao,LIU Xin-yu,CHENG Jun.Effect of Cu, In, Bi, S on the Properties of Sn/Ag Based Lead-free Solder[J].Electronic Components & Materials,2003,22(10):33-34. |
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| Authors: | LIN Pei-hao LIU Xin-yu CHENG Jun |
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| Abstract: | The effect of Cu, In, Bi, S on the melting point and the spread-ability of Sn/Ag based lead-free solder was studied. The results show that the melting point of 215℃ and better spread-ability can be achieved when Sn content is 95.5%, Ag content 3.5% and Cu conten 1%. The melting point can be reduced and the spread-ability improved by adding In appropriately. When Bi content increasing, the melting point of Sn/Ag/Bi ternary alloys rises and the spread-ability goes better; when S content increasing, the melting point of Sn/Ag alloys was rises but the spread-ability of Sn-Ag alloys can be improved by adding certain S content. |
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| Keywords: | Sn/Ag/alloy lead-free solder melting point spread-ability |
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