无卤素型挠性印制电路板材料

在制造挠性印制电路板用的挠性覆铜箔层压板的工艺过程中，为了提高线路图形用铜箔与绝缘基材聚酰亚胺薄膜的粘接性，研究开发了专用的表面处理技术和压制成型技术，制成了无卤素、两层结构型粘接性良好的挠性覆铜板；在线路图形表面的保护涂敷材料方面，研发了无机填料的处理技术，用少量的阻燃性填料即可使环氧树脂得出必要的阻燃性，保证了涂层的柔韧性：这两方面的技术促成了完全无卤素型印制电路板的产生。

Halogen-Free Flexible Printed Circuit Board Material

In the manufacturing process of flexible copper-clad laminate boards, the developed surface treatment process and pressure-forming technology for improving adhesion between the circuit copper foil and polyimide insulation layer has achieved strong bonding without using the conventional adhesive containing halogen-based flame retardant. Further, in the epoxy cover layer to protect the circuit pattern formed on the flexible copper laminate, adequate flame retardation has been obtained while maintaining flexibility by uniformly dispersing a small quantity of inorganic flame retardant after improving the particle surfaces for obtaining the maximum effectiveness and combining a variety of flame retardation technologies for epoxy-based adhesive. The application of these two technologies has achieved a completely halogen-free flexible printed circuit board material.