| 焊料合金粉在熔化过程中的氧化分析 |
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| 引用本文： | 武信. 焊料合金粉在熔化过程中的氧化分析[J]. 金属材料与冶金工程, 2012, 0(4): 3-6 |
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| 作者姓名： | 武信 |
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| 作者单位： | 云南锡业(控股)有限责任公司研究设计院,云南 个旧,661000 |
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| 摘 要： | 运用热力学和动力学的氧化原理,对焊料合金粉熔化时的氧化过程进行了分析.研究结果表明,在Sn-Pb焊料合金粉和Sn-Ag-Cu无铅焊料合金粉的氧化过程中,对Sn的氧化而言,其氧化产物主要是SnO2;对于Pb的氧化而言,主要生成PbO; Cu的氧化物主要是Cu2O,而Ag几乎不发生氧化.粉末中主要金属元素的氧化能力为:Sn＞Pb＞Cu.氧化速度随粉末粒度的细化和加热温度的升高而加剧,降低粉末界面的氧气浓度以及合理的熔化温度可降低氧化渣的形成率.
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| 关 键 词： | 焊料合金粉 氧化 比表面积 |
Oxidation Analysis on the Melting Process of Solder Alloy Powder |
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| WU Xin. Oxidation Analysis on the Melting Process of Solder Alloy Powder[J]. Metal Materials And Metallurgy Engineering, 2012, 0(4): 3-6 |
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| Authors: | WU Xin |
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| Affiliation: | WU Xin(Research and Design Institute of Yunnan Tin(Holding) Co.,Ltd.,Gejiu 661000,China) |
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| Abstract: | The oxidation process for solder alloy powder in the melting have been analyzed by thermodynamic and kinetic principles.The results show that,Sn is oxidized into SnO2,Pb is oxidized into PbO and Cu is oxidized into Cu2O,but there is little possible for Ag to oxide in the oxidation process of solder alloy powder Sn-Pb and Sn-Ag-Cu.Oxidation ability for main metals element in that powder is shown that Sn>Pb>Cu.The oxidation speed is increased with the powder granularity fining and the heating temperature increasing,formation rate of oxidation slag can be reduced by means of reducing the oxygen consistence of powder interface and holding rational melting temperature in the oxidation process. |
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| Keywords: | solder alloy powder oxidation surface area |
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