Cu-Sn-Ti钎料与陶瓷结合剂体积比对金刚石节块微观结构和力学性能的影响

为提高陶瓷结合剂对金刚石磨料的把持力，将Cu-Sn-Ti钎料添加到SiO₂-Al₂O₃-B₂O₃-Li₂O陶瓷结合剂中制得新型陶瓷-金属结合剂金刚石节块。表征其显微形貌、收缩率、物相组成和力学性能，以确定烧结温度；通过SEM、XRD分析，研究陶瓷结合剂与Cu-Sn-Ti钎料的体积比变化对金刚石节块性能的影响。结果表明:金属陶瓷结合剂与金刚石之间生成了TiC，有助于提高结合剂对金刚石的把持力，从而提高节块的抗弯强度；当烧结温度为950 ℃，陶瓷结合剂与Cu-Sn-Ti钎料体积比为1∶1时，两者形成致密的玻璃网络，节块收缩率为3%，抗弯强度达到最大值64.4 MPa。 

Effect of volume ratio between Cu-Sn-Ti alloy and vitrified binder on microstructures and mechanical properties of diamond segments

To improve the holding strength of bond to the diamond grits, a Cu-Sn-Ti alloy was introduced as an additive into the SiO₂-Al₂O₃-B₂O₃-Li₂O vitrified bond, which was then made into segments with diamonds. Some properties of the segments, namely microstructure, shrinkage, phase composition and mechanical properties, were characterized to determine the sintering temperature and the effect of volume ratio of Cu-Sn-Ti alloy in the vitrified bond on the segment performances was studied by SEM and XRD analysis. The results show that TiC phase is formed between the diamond and the cermet bond, which improves the holding strength of the bond to the diamond and then the bending strength of the segments. When the volume ratio of binder to Cu-Sn-Ti alloy is 1∶1, there forms a dense glass network in the segments sintered at 950 ℃, with shrinkage of 3% and maximum bending strength of 64.4 MPa.