氮化铝陶瓷表面化学镀铜溶液组成的优化

采用正交试验方法研究了镀液组成对氮化铝(AIN)陶瓷表面化学镀铜镀速和表面粗糙度的影响.经过直观分析和方差分析,评价了各组分对化学镀影响的显著程度,优化了镀液组成.试验结果表明,CuSO_4·5H_2O和Na_2EDTA对镀速有显著影响;KNaC_4H_4O_6、CuSO_4·5H_2O和Na2EDTA对镀后表面粗糙度有显著影响;AIN陶瓷表面化学镀铜液的最优工艺参数为:CuSO_4·5H_2O 24 g/L,Na_2EDTA 30 g/L,KNaC_4H_4O_6 20 g/L和HCHO 15 mol/L.在最优工艺条件下,镀速为7.350 μm/h,镀后表面粗糙度为1.03 μm,所得镀层表面平整,铜晶粒大小均匀.

Optimization of bath composition for electroless copper plating on aluminum nitride ceramic surface

The effect of bath composition of electroless copper plating on aluminum nitride(AlN)ceramic surface on the plating speed and surface roughness was studied by orthogonal test.The influence degree of individual component on electroless plating was estimated bv intuitive and variance analysis,and the bath composition was optimized.The test results showed that CuSO_4·5H_2O and Na_2EDTA have a remarkable effect on the plating speed,and KNaC_4HO_6,CuSO_4·5H_2O and Na_2EDTA have a great influence on the surface roughness.The optimal process parameters of the bath for electroless copper plating on AlN ceramic surface are as follows:CuSO_4·5H_2O 24 g/L,Na_2EDTA 30 g/L,KNaC_4H_4O_6 20 g/L and HCHO 15 mL/L.In the optimal conditions,the plating speed is 7.350 μm/h,the surface roughness of deposit is 1.03μm and an level surface and uniform grain size of copper were observed.