环氧/酚醛/苯并恶嗪三元体系的电子封装应用研究

设计制备了一种联苯型环氧树脂/芳烷基酚醛树脂/二胺型苯并恶嗪树脂三元共混体系,考察了树脂组成、不同促进剂及添加量对三元体系固化行为的影响,并对其电子封装模塑料应用进行了研究。结果表明,三元树脂体系中,联苯型环氧树脂和芳烷基酚醛树脂使固化物具有良好的热稳定性,苯并恶嗪的加人则有效提高了固化物的交联密度、玻璃化转变温度(Tg)以及热分解残留率,同时赋予体系低介电性。固化促进剂的加入使三元体系能够在较低温度下固化成型,满足现有环氧模塑料加工成型工艺。通过配方优化,所得模塑料固化物的Tg;可达210℃,起始热分解温度(Td5%)>390℃,同时具有较好的力学性能及低介电性,在功率器件封装领域显示出了良好的应用前景。

Study on the application of epoxy resin/phenolic resin/benzoxazine ternary system for electronic packaging

The ternary resin blending system of biphenyl-type epoxy resin,aralkyl phenolic resin and MDA-type benzoxazine was designed and prepared.The effects of resin composition,curing accelerators and their dosage on the curing behaviour of the ternary resin system were investigated and its application for electronic packaging molding compound was studied.The results showed that,for the ternary resin system,the biphenyl-type epoxy resin and aralkyl phenolic resin made the cured product have good thermal stability.The addition of benzoxazine effectively improved the crosslinking density,glass transition temperature(Tg)and thermal decomposition residual rate while giving the system low dielectric properties.The addition of curing accelerator enabled the ternary resin system to be molded at lower temperature,which met the requirements of the existing epoxy molding compound processing and molding process.Through the formula optimization,the Tg of the obtained molding compound cured product could reach 210°C,and the initial thermal decomposition temperature(Td5%)was greater than 390 T!.At the same tim e,it had good mechanical properties and low dielectric properties.It showed good application prospects in the field of power device packaging.