基于动力学性能的粘片机2PRR焊头机构尺度优化

IC粘片机的2PRR焊头机构为高速高精度运动部件,仅以尺寸和运动学指标对其进行优化设计难以达到性能最优的效果,故提出了基于动力学性能指标最优的尺度优化方法及其求解算法(双重遗传算法)。首先,建立2PRR并联机构的动力学方程并确定其关键尺寸和工作空间基准点坐标作为优化变量;然后,以工作空间范围内动力学性能最优为目标建立优化模型,并列出了约束条件;最后,通过双重遗传算法求得优化结果。算法结果收敛表明该方法有效。该方法对高速高精度机构的优化设计具有参考价值。

Dimensional Optimization of a 2PRR Bonding Head Mechanism in an IC Bonder Based on Dynamic Performance

The 2PRR bonding head mechanism of an IC bonder is a high-speed and high-precision moving part,which cannot obtain the optimal performance by optimization only based on the size and the kinematics.Therefore,a dimensional optimization method based on the optimal dynamic performance index and its solution using the two-layer genetic algorithm is proposed.First,the dynamic equation of the 2PRR parallel mechanism is established,and its key dimensions and reference point coordinates of its workspace are identified as optimization variables.Then,the optimization model is established with the optimal goal based on dynamic performance index in the workspace of the mechanism,and corresponding constraints are listed.Finally,optimization results are obtained by the two-layer genetic algorithm.The results are convergent,indicating that the dimensional optimization method is valid.The method has reference value for the optimization design of high-speed and high-precision mechanisms.