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| 3，3’-二乙基-4，4’-二苯甲烷型多马来酰亚胺／聚苯醚树脂的固化反应研究 | |
| 引用本文： | 柯刚,浣石,肖建华,刘晓国,冯勇跃. 3，3’-二乙基-4，4’-二苯甲烷型多马来酰亚胺／聚苯醚树脂的固化反应研究[J]. 广东化工, 2008, 35(8) |
| 作者姓名： | 柯刚 浣石 肖建华 刘晓国 冯勇跃 |
| 作者单位： | 1. 广州大学,工程抗震研究中心,广东,广州,510405 2. 广东警官学院治安系,广东,广州510440 3. 广州大学,化学化工学院,广东,广州,510006 4. 武汉大学,分析测试中心,湖北,武汉,430072 |
| 基金项目： | 广州市科技攻关计划资助项目 |
| 摘 要： | 热固性聚苯醚(PPO)已成为高性能印制电路板用树脂(PCB)发展的主流。本课题组的前期研究表明,3,3,-二乙基-4,4,-二苯甲烷型多马来酰亚胺(PEDM)/烯丙基化PPO是一种新型高性能PCB用树脂。文章采用红外光谱和裂解气相色谱,对PEDM的含量为PPO 10%的PEDM/烯丙基化PPO树脂的固化反应进行研究,结果表明,PEDM分子的不饱和双键与PPO的烯丙基和羟基在加热过程中发生了反应。 |
| 关 键 词： | 聚苯醚 多马来酰亚胺 热固性树脂 固化反应 |
Study on Curing Reaction of Poly(Phenylene Oxide) Resin with a Polymaleimide of Bis(3-ethyl-4-maleimidophenyl)Methane Type |
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| Ke Gang,Huan Shi,Xiao Jianhua,Liu Xiaoguo,Feng Yongyue. Study on Curing Reaction of Poly(Phenylene Oxide) Resin with a Polymaleimide of Bis(3-ethyl-4-maleimidophenyl)Methane Type[J]. Guangdong Chemical Industry, 2008, 35(8) | |
| Authors: | Ke Gang Huan Shi Xiao Jianhua Liu Xiaoguo Feng Yongyue |
| Affiliation: | Ke Gang1,Huan Shi1,Xiao Jianhua2,Liu Xiaoguo3,Feng Yongyue4 |
| Abstract: | Thermosetting poly(phenylene oxide)(PPO) has been the mainstream of development of printed circuit board with high performances.Previous studies in our team showed that polymaleimide of bis(3-ethyl-4-maleimidophenyl)methane type(PEDM)/allylated poly(phenylene oxide)(PPO) resin was a novel resin of printed circuit board.In this study,FTIR and pyrolysis gas chromatograph were combined to analyze curing reaction of the PEDM/allylated PPO resin,in which weight of the PEDM was 10 % of that of the PPO resin.Results showed that unsaturated double bonds of the PEDM molecules reacted with allyl and hydroxyl groups of the PPO in heating process. |
| Keywords: | poly(phenylene oxide) polymaleimide thermosetting resin curing reaction |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |