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Thermal Stability of Thin Film Corundum‐Type Solid Solutions of (Al1–xCrx)2O3 Synthesized Under Low‐Temperature Non‐Equilibrium Conditions
Authors:J. Ramm  M. Ante  H. Brändle  A. Neels  A. Dommann  M. Döbeli
Affiliation:1. Oerlikon Balzers Coating AG, Iramali 18, LI‐9496 Balzers, Principality of Liechtenstein;2. Institute of Microtechnology, University of Neuchatel, Rue Jaquet‐Droz, CH‐2002 Neuchatel, Switzerland;3. Centre Suisse d'Electronique et de Microtechnique CSEM SA, Rue Jaquet‐Droz 1, CH‐2002 Neuchatel, Switzerland;4. Ion Beam Physics, Paul Scherrer Institute and ETH Zurich, Schafmattstrasse 20, CH‐8093 Zürich, Switzerland
Abstract:
Keywords:Alumina  Chemical vapor deposition  Corundum  Physical vapour deposition
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