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Model‐Based Analysis of the ZrO2 Etching Mechanism in Inductively Coupled BCl3/Ar and BCl3/CHF3/Ar Plasmas
Authors:Mansu Kim  Nam‐Ki Min  Sun Jin Yun  Hyun Woo Lee  Alexander M Efremov  Kwang‐Ho Kwon
Abstract:The etching mechanism of ZrO2 thin films and etch selectivity over some materials in both BCl3/Ar and BCl3/CHF3/Ar plasmas are investigated using a combination of experimental and modeling methods. To obtain the data on plasma composition and fluxes of active species, global (0‐dimensional) plasma models are developed with Langmuir probe diagnostics data. In BCl3/Ar plasma, changes in gas mixing ratio result in nonlinear changes of both densities and fluxes for Cl, BCl2, and BCl2+. In this work, it is shown that the nonmonotonic behavior of the ZrO2 etch rate as a function of the BCl3/Ar mixing ratio could be related to the ion‐assisted etch mechanism and the ion‐flux‐limited etch regime. The addition of up to 33% CHF3 to the BCl3‐rich BCl3/Ar plasma does not influence the ZrO2 etch rate, but it non‐monotonically changes the etch rates of both Si and SiO2. The last effect can probably be associated with the corresponding behavior of the F atom density.
Keywords:ZrO2  etch rate  dissociation  ionization  etch mechanism  BCl3/Ar and BCl3/CHF3/Ar plasma modeling
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