首页 | 本学科首页   官方微博 | 高级检索  
     


Finite element analysis of combined forming processes by means of rate dependent ductile damage modelling
Authors:Y Kiliclar  I N Vladimirov  S Wulfinghoff  S Reese  O K Demir  C Weddeling  A E Tekkaya  M Engelhardt  C Klose  H J Maier  M Rozgic?  M Stiemer
Affiliation:1.Institute of Applied Mechanics,RWTH Aachen University,Aachen,Germany;2.MTU Aero Engines AG,München,Germany;3.TU Dortmund, Institute of Forming Technology and Lightweight Construction,Dortmund,Germany;4.Institut für Werkstoffkunde (Materials Science),Leibniz Universit?t Hannover,Garbsen,Germany;5.Theory of Electrical Engineering,Helmut Schmidt University,Hamburg,Germany
Abstract:Sheet metal forming is an inherent part of todays production industry. A major goal is to increase the forming limits of classical deep-drawing processes. One possibility to achieve that is to combine the conventional quasi-static (QS) forming process with electromagnetic high-speed (HS) post-forming. This work focuses on the finite element analysis of such combined forming processes to demonstrate the improvement which can be achieved. For this purpose, a cooperation of different institutions representing different work fields has been established. The material characterization is based on flow curves and forming limit curves for low and high strain rates obtained by novel testing devices. Further experimental investigations have been performed on the process chain of a cross shaped cup, referring to both purely quasi-static and quasi-static combined with electromagnetic forming. While efficient mathematical optimization algorithms support the new viscoplastic ductile damage modelling to find the optimum parameters based on the results of experimental material characterization, the full process chain is studied by means of an electro-magneto-mechanical finite element analysis. The constitutive equations of the material model are integrated in an explicit manner and implemented as a user material subroutine into the commercial finite element package LS-DYNA.
Keywords:
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号