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Binary semiconductor In2Te3 for the application of phase-change memory device
Authors:Hao Zhu   Kai Chen   Zhongyang Ge   Hanni Xu   Yi Su   Jiang Yin   Yidong Xia  Zhiguo Liu
Affiliation:(1) National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, Nanjing, 210093, People’s Republic of China;(2) National Laboratory of Solid State Microstructures and Department of Materials Science and Engineering, Nanjing University, Nanjing, 210093, People’s Republic of China;
Abstract:Nonvolatile phase-change memory devices with 500 nm contact hole based on In2Te3 were successfully fabricated by using focused ion beam, pulsed laser deposition, and dc magnetic sputtering techniques. In2Te3 films were characterized by using differential thermal analysis, X-ray diffraction, and UV–vis diffuse absorption spectroscopy, respectively. The devices can be switched between high and low resistance states repeatedly with the programmed voltage pulses. The reset operation (crystalline to amorphous) was done by the voltage pulse with a magnitude of 3.5 V and a duration of 30 ns, and the set operation (amorphous to crystalline) was done by the voltage pulse with a magnitude of 1.4 V and a duration of 100 ns. A dynamic resistance switching ratio (OFF/ON ratio) of 3.2 × 103 has been obtained.
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