| 关于PBGA中“爆玉米花”现象的分析 |
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| 引用本文： | 杨建生,徐元斌. 关于PBGA中“爆玉米花”现象的分析[J]. 电子与封装, 2002, 2(1): 7-14 |
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| 作者姓名： | 杨建生 徐元斌 |
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| 作者单位： | 甘肃天水永红器材厂技术中心,甘肃,天水,741000 |
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| 摘 要： | 本文运用断裂力学法分析塑料焊球阵列封装(PBCA)的爆玉米花现象,专门对封装粘片中发生的裂纹,粘片中的裂纹增大以及焊料掩模和铜之间界面处裂纹增大进行研讨,通过两种方法(裂纹尖端开度位移法和有效裂纹闭合技术)确定裂纹尖端参数,诸如应变能释放率,应力强度系数及不同裂纹长度的相角。
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| 关 键 词： | 塑料焊球阵列封装 断裂力学法 裂纹长度 爆玉米花现象 裂纹尖端参数 |
| 修稿时间： | 2001-10-21 |
Temperature - Dependent Popcorning Analysis of Plastic Ball Grid Array Packaging During Solder Refiow with Fracture Mechanics Mothod |
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| Abstract: | The popcorning effect of plastc ball grid array(PBGA)is analyzed using the method of fracture mechanics.The following specific problems are mainly studied:crack initiation in the die attach of the pack- age;crack growth in the die attach,and crack growth at the interface between the solder mask and coppr. Two different methods(crack tip opening displacement and virtual closure technique)are used to determine the crack-tip parameters such as the strain energy release rate,stress intensity factors,and phase angle for different crack lengths and temperatures. |
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| Keywords: | PBGA Fracture mechanics method Crack length Popcoming effect Crack-tip parameters |
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