| 电子封装工艺及过程管控体系 |
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| 引用本文： | 张华洪,鄢胜虎. 电子封装工艺及过程管控体系[J]. 电子工业专用设备, 2011, 40(7): 44-47,52 |
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| 作者姓名： | 张华洪 鄢胜虎 |
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| 作者单位： | 汕头华汕电子器件有限公司工程部,广东汕头,515300 |
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| 摘 要： | 介绍了华汕电子半导体的产品发展趋势和品质保障体系,着重阐述了三个关键封装工艺中的重要特性的管理方法和注意事项。然后介绍了过程异常及测试成品率管控措施。最后介绍了华汕防静电（ESD）体系。
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| 关 键 词： | 封装工艺 成品率 防静电 |
Assembly Technology and Process Control System in Huashan Semiconductor |
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| ZHANG Huahong,YAN Shenghu. Assembly Technology and Process Control System in Huashan Semiconductor[J]. Equipment for Electronic Products Marufacturing, 2011, 40(7): 44-47,52 |
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| Authors: | ZHANG Huahong YAN Shenghu |
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| Affiliation: | (Engineering Department of Shantou Huashan Electronic Devices CO.,LTD,Shantou 515300,China) |
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| Abstract: | First,in this paper we introduce the growing trend of the products and the quality assurance system in Shantou Huashan Semiconductor.Firstly,we introduce the key points of the management method of the quality system,especially on the three key steps in th |
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| Keywords: | Assembly Technology Yield ESD |
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