| 硫脲稳定化学镀镍的机理 |
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| 引用本文： | 韩克平 方景礼. 硫脲稳定化学镀镍的机理[J]. 电镀与精饰, 1996, 18(3): 11-14 |
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| 作者姓名： | 韩克平 方景礼 |
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| 作者单位： | 南京大学化学化工学院，南京大学应用化学研究所 |
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| 摘 要： | 测定了硫脲对镍的沉积速度和氢的析出量的影响。结果表明，一定量的硫脲（大于３ｍｇ／Ｌ）可同时抑制镍的沉积和氢的析出，用电化学方法研究了化学镀镍液的电化学行为。并借助ＸＰＳ对化学镀镍层进行了分析。提出了硫脲稳定化学镀镍的机理。
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| 关 键 词： | 硫脲 镀镍 电镀 稳定性 |
Stabilition Mechanism of Thiourea for Electroless Nickel Plating |
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| Han Keping,Fang Jingli. Stabilition Mechanism of Thiourea for Electroless Nickel Plating[J]. Plating & Finishing, 1996, 18(3): 11-14 |
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| Authors: | Han Keping Fang Jingli |
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| Abstract: | Effect of thiourea on nickel deposition rate and hydrogen evolution amount was determined.It was found that a certain amount of thiourea can inhibit nickel deposition and hydrogen evolution simultaneously.Electrochemical behaviours of the electroless nickel plating bath were studied using electrochemical method.The deposit was also analyzed by means of XPS.The mechanism of stabilizing effect of thiourea on electroless nickel plating has been proposed. |
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| Keywords: | thiourea electroless nickel plating stabilization mechanism electrocemical method |
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