表面安装和高密度印制线路板

当今电子，通信产品日新月异，要求电路板高密度组装，安装方式由表面实地以代通孔插装已 历史的必然，因此，印制板技术正向高密度多层化方向飞速发展。文中介绍电子元器件和装配方法演变，电路板方式种类表面安装用印制板的特点，实现印制板高密度多层化的方法，印制板安装密度的选择，评估，认定印制板委托加工的要素以及现今印制板一般加工范围。

SMT & High-Density Printed-Circuit-Boards(PCB)

Nowadays,high-density and multi-layer PWB technology are developing faster and faster in order to meet the need of rapid progress of electronic and communication products So it has become a must to substitute SMT for THT This paper mainly introduces the development of electronic devices and assembly modes,characteristics of PWB using SMT,ways of realizing high-density & multi-layer PWB,assessment and determination of assembly density, as well as main points considered to select PWB processing factory and usual norms of process