| TiO_2纳米颗粒掺杂对Sn-3.0Ag-0.5Cu-xTiO_2焊点界面Cu_6Sn_5 IMC晶粒生长的影响机理 |
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| 引用本文： | 唐宇,骆少明,王克强,李国元. TiO_2纳米颗粒掺杂对Sn-3.0Ag-0.5Cu-xTiO_2焊点界面Cu_6Sn_5 IMC晶粒生长的影响机理[J]. 焊接学报, 2015, 36(12): 56-60 |
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| 作者姓名： | 唐宇 骆少明 王克强 李国元 |
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| 作者单位： | 仲恺农业工程学院 自动化学院, 广州 510225;华南理工大学 电子与信息学院, 广州 510640,仲恺农业工程学院 自动化学院, 广州 510225,仲恺农业工程学院 自动化学院, 广州 510225,华南理工大学 电子与信息学院, 广州 510640 |
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| 基金项目： | 中央高校基本科研业务费专项资金资助项目(2014ZB0032);广东省自然科学基金资助项目(2014A030313594);广东省科技计划资助项目(2014A020208139; 2015A020209179);广东高校特色创新资助项目(KA1548812) |
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| 摘 要： | 研究了Ti O2纳米颗粒掺杂影响回流焊过程中Sn-3.0Ag-0.5Cu-x Ti O2焊点界面Cu6Sn5金属间化合物(intermetallic compound,IMC)晶粒生长机理.基于Cu原子扩散通量驱动晶粒成熟生长(flux driven ripening,FDR)理论模型分析了Cu6Sn5IMC晶粒生长机理.结果表明,Ti O2纳米颗粒掺杂改变了焊点界面Cu6Sn5IMC晶粒形貌和尺寸.含Ti O2纳米颗粒的焊点Cu6Sn5IMC晶粒尺寸要小于不含Ti O2纳米颗粒的焊点,且晶粒分布要更加均匀.试验数据与FDR理论模型基本吻合.Cu6Sn5IMC晶粒生长指数分别为0.346,0.338,0.332和0.342,这说明Cu6Sn5IMC晶粒生长是由原子互扩散和晶粒成熟共同控制.
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| 关 键 词： | 无铅焊料 二氧化钛纳米颗粒 金属间化合物 晶粒成熟 回流焊 |
| 收稿时间： | 2014-11-25 |
Influence of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-x TiO2 solder joints |
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| TANG Yu,LUO Shaoming,WANG Keqiang and LI Guoyuan. Influence of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-x TiO2 solder joints[J]. Transactions of The China Welding Institution, 2015, 36(12): 56-60 |
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| Authors: | TANG Yu LUO Shaoming WANG Keqiang LI Guoyuan |
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| Affiliation: | College of Information, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China;School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China,College of Information, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China,College of Information, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China and School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China |
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| Abstract: | Effect of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints during reflow process was investigated in this study. Flux-driven ripening (FDR) theoretical model is adopted to analyze the Cu6Sn5 IMC grain ripening growth mechanism. Results show that nano-TiO2 dopant could alter both the morphology and size of Cu6Sn5 IMC grain. The size of Cu6Sn5 IMC grain in TiO2-containg solder joints is smaller than that in TiO2-free solder joints, and the Cu6Sn5 IMC grain in TiO2-containg solder joints is more uniform and evenly distributed than those in TiO2-free solder joints. The FDR theoretical model was well consistent with the experimental data. The growth exponents of Cu6Sn5 IMC grain in Sn-3.0Ag-0.5Cu-xTiO2 solder joints are 0.346, 0.338, 0.332, and 0.342, respectively. This indicates that Cu6Sn5 IMC grain growth is controlled by atomic interdiffusion and grain maturity. |
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| Keywords: | Lead-free solder TiO2 nanoparticles intermetallic compound grain ripening reflow soldering |
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