Thickness improvement in single point incremental forming deduced by sequential limit analysis

Multistage forming is one of the most practical solutions to avoid severe thinning in single point incremental forming (SPIF). A successful implementation of multistage SPIF is strongly dependent on an appropriate deformation path. In this paper, firstly, a simplified modeling technique is proposed using sequential limit analysis. It is shown that sequential limit analysis can predict the thickness distribution faster than an equivalent model in a commercial finite element modeling code like Abaqus can. The reliability of the model is assessed by comparing experimental and simulated results for single-stage and multistage SPIF cones. This model is utilized to study the effect of various deformation paths on the thickness distribution. As a result, a new multistage strategy is designed and implemented to form a 70° wall angle cone in three stages. The thickness distribution of the cone is improved significantly compared to cones formed by a single-stage and a conventional three-stage strategy. Besides this improvement, the new multistage SPIF can be carried out in much less time.